Core Processes of Printer Chip Reverse Engineering---Chip Pretreatment

Core Processes of Printer Chip Reverse Engineering---Chip Pretreatment

Toner chip reverse engineering is a technology that strips the chip materials layer by layer through chemical methods and analyzes the internal structure of the chip using a scanning electron microscope (SEM). 

Attackers can infer the chip's functions and design code by extracting the circuit layout and gate - level netlist. This method is usually used to crack the design logic of the chip.

It is essentially a technology that reverse - deduces the printer chip design logic through physical deconstruction + micro - analysis, with a dual nature of “technical research” and “security risks”. 

This series article will help you understand this technology more comprehensively from four dimensions: core processes, key objectives, application scenarios (legal vs illegal), and protection methods:

Core Processes of Printer Chip Reverse Engineering (from “disassembly” to “deduction”)

The “chemical stripping + SEM analysis” is the core step of physical deconstruction, but a complete reverse requires the cooperation of multiple links. It can be divided into 5 steps specifically:

Chip Pretreatment

First, remove the external packaging of the chip (such as the epoxy resin shell) to expose the internal wafer. This step requires the use of chemical solvents (such as nitric acid, sulfuric acid) to dissolve the packaging material while avoiding damage to the circuit layer on the surface of the wafer.

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